Aluminum Nitride Substrates aln Ceramic
Aluminum nitride ceramic substrate
1. High thermal conductivity, more than 5 times that of alumina ceramics
2. Lower thermal expansion coefficient and close to silicon chip
3. Lower dielectric constant
4. Excellent insulation
5. Excellent mechanical properties, flexural strength higher than al2o3 and beo ceramics, can be sintered at atmospheric pressure
6. Heat-resistant, melt-resistant metal erosion
7. non-toxic
Apply to :
such as communication devices, led packages, power electronics devices, semiconductor refrigeration devices, high-power integrated circuits, new energy vehicles, etc.
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Product
Description
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Product name
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Ceramics
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MOQ
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10 pcs
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Payment
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Western Union ; T/T
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Place of Origin
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Hunan,China
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Maritime port
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Shanghai , Shenzhen
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Performance
Index
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Color
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Gray
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Density
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≥3.33 g/cm³
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Thermal Conductivity
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1) ≥170 W/m·K ; 2) ≥200 W/m.k
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Flexural Strength
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≥380 MPa
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Camber
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≤2‰
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Surface roughness Ra
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1)Lapped: 0.3~0.6 um 2)Polished: ≤ 0.05um
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Thermal expansivity
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20~300℃ 2~3
10-6/℃
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| 300~800℃ 2.5~3.5 10-6/℃ | ||||
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Product
Specification
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Thickness(mm)
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Size(mm)
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0.38
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50.8*50.8;
76.2*76.2; 101.6*101.6; 110*110; 114.3*114.3; 120*120; 127*127
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0.5
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0.635
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1
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1.2
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1.5
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